04 — Nanotechnology
Computation at the millimetre
A computer the size of a millimetre, with a radio and a job to do.
I design nanocomputers on the order of 1 mm × 1 mm that run arrays of nanosensors and report over Bluetooth to a phone or a router. The point is not smallness for its own sake — it is putting precise measurement and control where a normal board could never fit.
At a square millimetre, the device is no longer a board you populate. It is a system you co-design with the physics.
A nanocomputer at this scale does three things at once: it reads a set of nanosensors, it makes a local decision or aggregates a measurement, and it gets that result off the die over a radio. There is no room for a separate sensor board, a separate MCU board, and a separate radio module. Sensing, compute, and the Bluetooth link have to share the same silicon — a system-on-chip in the literal sense.
I work this from two directions. On the device side it is nanoelectronics: laying out circuits at scales where the tidy textbook assumptions — clean voltage levels, negligible leakage, parasitics you can ignore — stop holding, and the layout itself becomes part of the circuit. On the workflow side it is a bench discipline: a microscope and a microsoldering setup, so I can fabricate, rework, and inspect parts that are below the threshold of the naked eye.
The two application targets are deliberate. One is biomedical control, where the constraint is that the device has to be small enough and quiet enough to sit close to the thing it measures. The other is industrial control that requires nanometric precision — processes where the tolerance band is narrow enough that an ordinary sensor-and-PLC loop cannot hold it. Same discipline, two very different rooms.
footprint of the nanocomputer die that manages an array of nanosensors
the link out — Bluetooth to a mobile application or a wireless router
particle size from the high-pressure microfluidization line, on the materials side
development board vendors I build against — Nordic, Texas Instruments, Maxim
What a square millimetre actually means.
The 1 mm² nanocomputer
The whole computer fits inside the head of a pin.
It is hard to keep the scale honest in words, so I keep a reference in front of me. A grain of rice is roughly five to six millimetres long. A sesame seed is about three. The die I am describing is one millimetre on a side — smaller than the seed, and it carries the sensing front-end, the controller, and the radio together.
Designing at that size is not the same circuit made smaller. Wire resistance, capacitive coupling between neighbouring traces, and current leakage all scale into the foreground. The layout stops being a transcription of the schematic and becomes a first-class part of whether the thing works.
- Sensing front-end, controller and radio on one die
- Layout parasitics treated as circuit elements, not afterthoughts
- Power budget set by what a body or a process loop can spare
From the sensor to your screen.
Nanosensor → BLE → app
The whole point is the last hop: getting the measurement out.
A measurement nobody can read is not control. So the architecture I care about is the full path: a nanosensor produces a tiny analog signal, the on-die controller conditions and reads it, the Bluetooth radio packages it, and it lands in a mobile application or at a wireless router that forwards it onward.
Each hop has a cost. The analog front-end fights noise that is large relative to the signal. The radio is usually the biggest single draw on the power budget, so it spends most of its life asleep and wakes only to send. Keeping that chain honest end to end is most of the engineering.
- Analog front-end: condition a signal smaller than its own noise floor
- Radio duty-cycled — asleep by default, awake only to transmit
- Endpoint is a phone app or a Wi-Fi router that relays the data
Smallness is not the achievement. The achievement is precise measurement and control somewhere a normal board could never go.
Where the discipline actually lives.
Designing where the textbook stops applying.
At these dimensions the simplifying assumptions of ordinary board design fall away. Leakage current is no longer negligible, parasitic capacitance between adjacent traces couples signals you meant to keep apart, and the resistance of the interconnect itself shows up in the timing budget.
So I treat the layout as part of the circuit rather than a packaging step after it. The work is SoC integration in earnest: getting the sensing front-end, the controller, and the radio to share one die without each one corrupting the others.
- Leakage, parasitics and interconnect resistance as design variables
- SoC integration: sensor + MCU + radio on a single die
- Power budgeting against what a body or a process can supply
The same nanoscale discipline, applied to fluids.
The nanoscale habit of mind does not stop at silicon. On the materials side I work nanofluid engineering: a high-pressure microfluidization line that drives particle size down to roughly 50 microns, and formulations where oil-based and water-based molecules coexist in one stable system without emulsifiers.
It is the same problem framed in a different medium — controlling matter at a scale where surface effects dominate bulk behaviour. Whether the substrate is a fluid or a wafer, the engineering question is the same: hold the structure together at a size where ordinary intuition no longer governs.
- High-pressure microfluidization to ~50 micron particle size
- Oil- and water-based molecules coexisting without emulsifiers
- Surface-dominated behaviour engineered on purpose
A bench that can reach below the eye.
Building and reworking parts this small needs a bench that can see and touch them. I work with a microscope for inspection and a microsoldering setup for assembly and repair, so the loop from design to a physical, testable part stays in my own hands.
Development happens against real silicon platforms rather than in simulation alone. I build against boards from Nordic, Texas Instruments, and Maxim Integrated — chosen for their low-power radios, analog front-ends, and precision data-acquisition parts.
- Microscope-assisted inspection of sub-millimetre assemblies
- Microsoldering for assembly and rework
- Dev boards from Nordic, Texas Instruments and Maxim Integrated
Six steps from a physical quantity to a packet.
The data path is not a diagram you admire once and move past. It is a sequence of six steps, and every one of them can quietly ruin the measurement if you let it.
I keep the chain explicit because each hop has a different failure mode. The transducer can drift. The front-end can add more noise than it removes. The converter can sample at the wrong instant. The local logic can throw away the one sample that mattered. The radio can drain the budget faster than the source can refill it. And the relay can simply not be listening. Naming the steps is how I keep each one accountable.
Notice where the intelligence sits. The cheapest packet is the one you never send, so the controller decides locally — aggregating, thresholding, discarding — before the radio ever wakes. On a sub-millimetre node the radio is usually the largest single draw, so the whole design leans on sending less, not sending faster.
Nanosensor acquisition — transduce to relay
- 01 Transduce the nanosensor turns a physical quantity into a faint electrical signal
- 02 Condition the analog front-end amplifies and filters it against its own noise floor
- 03 Convert the controller digitises the conditioned signal and timestamps it
- 04 Decide local logic aggregates, thresholds, or discards before anything goes on the air
- 05 Transmit the radio wakes, sends a short BLE packet, and goes back to sleep
- 06 Relay a phone app or a Wi-Fi router receives the packet and forwards it onward
A node that mostly sleeps.
Powering a sub-millimetre node
At this size, the power budget is the design.
A node this small has almost no energy reservoir, so the architecture is built around scarcity rather than abundance. A small harvesting or storage element feeds a regulator; the regulator holds the front-end and the controller at a quiet bias; and the radio — the expensive part — stays dark until there is something worth saying.
The link itself is the same story told in radio terms. BLE earns its place here because it is built for exactly this duty cycle: brief, low-power bursts with long silences between them. The job is to close the link budget to a phone or a router on the smallest possible transmission, then get the radio back to sleep before it costs anything.
- Tiny store and regulator hold a quiet operating bias
- Radio dark by default, awake only for a short burst
- Link budget closed on the smallest transmission that still reaches the relay
Where the precision has to land.
The same die answers two very different briefs. Both ask for nanometric precision; they ask for it in opposite environments.
In the biomedical case the binding constraint is proximity. The device has to sit close to the thing it measures and stay small and quiet enough not to disturb it. Size is not a marketing point here — it is the only way the measurement is honest, because a larger or louder instrument changes the very signal it is reading.
In the industrial case the binding constraint is the tolerance band. Some processes hold a window narrow enough that an ordinary sensor-and-PLC loop cannot keep up with it — by the time a coarse loop notices the drift, the part is already out of spec. A node with nanometric resolution sitting inside the process can see the drift while it is still small.
Both rooms reward the same discipline: put a precise, well-characterised measurement exactly where it is needed and report it without disturbing anything. The hardware is largely shared; what changes is the envelope it has to survive and the language the endpoint speaks.
Closing the loop
Measurement is only half of control.
A precise reading that arrives too late, or that nobody acts on, is not control — it is telemetry. So I design the node as one end of a loop: it measures, it reports over BLE, and something downstream closes the loop by acting on what it sent.
The narrower the tolerance, the more the timing of that loop matters. The diagram traces the cycle: a setpoint, a measurement against it, the error between them, and the correction that feeds back — the whole reason a nanometric sensor is worth putting where it is hard to put one.
- Setpoint and measurement compared on or near the die
- Error reported over BLE to the controlling endpoint
- Correction closes the loop before the drift leaves the band
The same habit of mind, in a fluid.
Nanofluids via microfluidization
Holding structure together where surfaces win over bulk.
The nanoscale way of thinking does not stop at silicon. On the materials side I run a high-pressure microfluidization line that drives particle size down to roughly 50 microns, producing formulations where oil-based and water-based molecules coexist in one stable system without emulsifiers.
It is the same problem in a different medium. Whether the substrate is a wafer or a fluid, the engineering question is identical: hold the structure together at a size where surface effects dominate bulk behaviour and ordinary intuition stops governing. The distribution diagram makes the crossover concrete — drive the particle population down and tighten its spread, and the fluid behaves like a single phase rather than two fighting ones.
- High-pressure microfluidization to a ~50 micron particle size
- Oil- and water-based molecules coexisting without emulsifiers
- Surface-dominated behaviour engineered on purpose, not fought
The bench discipline, in order.
None of this is simulation theatre. The reason I keep a microscope and a microsoldering bench is that the loop from a design decision to a physical, testable part has to stay short and stay in my own hands. The order below is the order I actually follow.
- 01 — Define Set the envelope before the schematic Fix the power ceiling, the measurement the sensor owes, and the link budget the radio has to close. Everything downstream is bounded by these three numbers.
- 02 — Layout Draw the die as a circuit Place the front-end, controller, and radio so they share a substrate without corrupting one another; treat parasitics and return paths as first-class elements.
- 03 — Build Assemble under the microscope Microsolder the parts and the support board, inspect the joints at magnification, and rework anything that will not survive a thermal cycle.
- 04 — Bring-up Wake the radio, read the sensor Bring the platform up on a Nordic, TI, or Maxim board; confirm the front-end reads true and the BLE link reaches a phone and a router.
- 05 — Characterise Measure it, do not trust it Sweep the operating range, log the real noise floor and current draw, and hold the result against the envelope set in step one.
What I hold constant across both rooms.
The application changes; the discipline does not. These are the principles that survive whether the node ends up in a body, in a process line, or — in the materials crossover — in a fluid.
Power budget first
I size the radio duty cycle and the front-end bias against what a body or a process loop can actually supply, then design inward from that ceiling.
Layout as circuit
Trace geometry, guard rings, and return paths are drawn as electrical elements — at this scale the layout decides whether the schematic holds.
Noise discipline
Separate the analog and digital domains on one die, keep the sensitive front-end away from the radio, and treat every coupling path as a measurement to be made.
One die, one job
Sensor, controller, and radio share the substrate, so I integrate them as a single system rather than three modules wired together.
Reach below the eye
A microscope and a microsoldering bench keep the loop from design to a physical, testable part in my own hands.
Build on real silicon
Development runs against Nordic, Texas Instruments, and Maxim Integrated platforms rather than simulation alone.
The parameters I design against.
Nanocomputer — operating envelope
- Compute footprint
- ~1 mm × 1 mm die
- Role
- manage nanosensor array + radio
- Wireless link
- Bluetooth Low Energy
- Link targets
- mobile app / Wi-Fi router
- Target domains
- biomedical · industrial control
- Precision class
- nanometric, high-precision
- Integration
- SoC — sensor, MCU, radio
- Dev platforms
- Nordic · TI · Maxim Integrated
- Bench
- microscope + microsoldering
- Materials crossover
- nanofluid engineering
Open to the right work
If your measurement or control problem only makes sense at a scale that won't fit a normal board, that is the work.
If you are holding a problem that doesn't fit inside one field, that is the conversation I want.